Halnziye 75Gram Thermal Conductive Glue Silicone Plaster Viscous Adhesive Cooling Compound for LED GPU Chipset Heatsink

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$8.98

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Brand: Halnziye

Features:

  • Do Not Use Thermal Glue Between CPU Chip And Heat Sink
  • Thermal conductivity:> 1.2W/m-K
  • Strength of connected buildings: 55 lb.
  • Features: thermal properties, strong adhesion
  • Application: apply to all heatsink no fixed clip thermal paste. Ideal for MOSFET Heatsink,VGA CARD Northbridge Southbridge Heatsink.

Details: * Application: apply to all heatsinkf no fixed clip thermal paste. Idea for MOSFET Heatsink, VGA CARD Northbridge Southbridge Heatsink. * Features: thermal properties, strong adhesion * Melting capacity: 0 (200°C/392°F / 24Hours) * Evaporation: 0.001% (200°C/392°F / 24Hours) * Thermal conductivity:> 1.2W/m-K * Thermal Impedance: <0.06 * Clotting time: 3min (25°C/77°F * Strength of connected buildings: 25Kg/55Lb * Insulation coefficient> 5.1 * Dissipation coefficient <0.005 * Temperature resistance: 200°C/392°F * Net Weight: 75g Do Not Use Thermal Glue Between CPU Chip And Heat Sink

EAN: 6971355449124

Item Condition: New